KIT UPGRADE PC ASRock B650M PG Riptide WIFI + AMD Ryzen 7 7800X3D (4.2 GHz / 5.0 GHz)

Name: KIT UPGRADE PC ASRock B650M PG Riptide WIFI + AMD Ryzen 7 7800X3D (4.2 GHz / 5.0 GHz)
SKU: 44548
Availability: OutOfStock

B650M PG Riptide WiFi

ASRock B650M PG Riptide WIFI

PRODUCT BRIEF:

Product Photo Supporte AMD Ryzen™ 8000 et 7000 Series Processors

12+2+1 Phase de puissance, Dr.MOS
4 x DDR5 DIMMs
Supporte Dual Channel, jusqu’à 7200+ (OC)
2 PCIe 4.0 x16, 2 PCIe 3.0 x1
Sorties graphiques disponibles: HDMI, DisplayPort
Realtek ALC897 l’audio 7.1 CH HD Codec, Nahimic l’audio
4 SATA3, 1 Blazing M.2 (PCIe Gen5x4)
1 Hyper M.2 (PCIe Gen4x4)
2 à l’arrière USB 3.2 Gen2 (Type A + Type-C)
1 USB 3.2 en façade Gen1 Type-C
6 USB 3.2 Gen1 (2 à l’arrière, 4 façade)
8 USB 2.0 (4 à l’arrière, 4 façade)
Dragon 2.5G LAN

Gaming and more

The AMD Ryzen 7 7800X3D is the ultimate gaming processor. This Zen 4 CPU offers nothing less than 8 physical cores and 16 logical cores, frequencies from 4.2 GHz to 5.0 GHz and 104 MB of V-Cache, so you can reach new heights of gaming performance! This processor for gamers based on the revolutionary AMD Zen 4 architecture is capable of doing it all: latest-generation games, simultaneous streaming and intensive multitasking.

AMD 3D V-CACHE 104 MB

Play the most demanding games with the phenomenal performance boost provided by AMD Ryzen 7000X3D Series processors featuring AMD 3D V-Cache technology. With this enthusiast-class processor, you can enjoy extreme performance for gaming, authoring, streaming or any other workload you choose. Plus, enjoy the benefits of next-generation AMD 3D V-Cache technology for low latency and even better gaming performance.

8 NATIVE CORES AND 16 LOGICAL CORES

The AMD Ryzen 7 7800X3D desktop processor offers 8 native cores and 16 logical cores for smooth multitasking. Thanks to its high native frequency and Turbo Core mode that adjusts power as needed, the next-generation AMD Ryzen Zen 4 CPU delivers exceptional performance for gaming, intensive multitasking, video editing, 3D modelling and more.

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